2 months ago
By Micron Technology, Inc.
Published [hour]:[minute] [AMPM] [timezone], [monthFull] [day], [year]
BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), a world leader successful representation and retention solutions, coming announced it has begun measurement accumulation of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H HBM3E will beryllium portion of NVIDIA H200 Tensor Core GPUs, which will statesman shipping successful nan 2nd almanac 4th of 2024. This milestone positions Micron astatine nan forefront of nan industry, empowering artificial intelligence (AI) solutions pinch HBM3E’s industry-leading capacity and power efficiency.
HBM3E: Fueling nan AI Revolution
As nan request for AI continues to surge, nan request for representation solutions to support gait pinch expanded workloads is critical. Micron’s HBM3E solution addresses this situation head-on with:
- Superior Performance: With pin velocity greater than 9.2 gigabits per 2nd (Gb/s), Micron’s HBM3E delivers more than 1.2 terabytes per 2nd (TB/s) of representation bandwidth, enabling lightning-fast information entree for AI accelerators, supercomputers, and information centers.
- Exceptional Efficiency: Micron’s HBM3E leads nan manufacture pinch ~30% little powerfulness depletion compared to competitory offerings. To support expanding request and usage of AI, HBM3E offers maximum throughput pinch nan lowest levels of powerfulness depletion to amended important information halfway operational disbursal metrics.
Seamless Scalability: With 24 GB of capacity today, Micron’s HBM3E allows information centers to seamlessly standard their AI applications. Whether for training monolithic neural networks aliases accelerating inferencing tasks, Micron’s solution provides nan basal representation bandwidth.
“Micron is delivering a trifecta pinch this HBM3E milestone: time-to-market leadership, best-in-class manufacture performance, and a differentiated powerfulness ratio profile,” said Sumit Sadana, executive vice president and main business serviceman astatine Micron Technology. “AI workloads are heavy reliant connected representation bandwidth and capacity, and Micron is very well-positioned to support nan important AI maturation up done our industry-leading HBM3E and HBM4 roadmap, arsenic good arsenic our afloat portfolio of DRAM and NAND solutions for AI applications.”
Micron developed this industry-leading HBM3E creation utilizing its 1-beta technology, precocious through-silicon via (TSV), and different innovations that alteration a differentiated packaging solution. Micron, a proven leader successful representation for 2.5D/3D-stacking and precocious packaging technologies, is proud to beryllium a partner successful TSMC’s 3DFabric Alliance and to thief style nan early of semiconductor and strategy innovations.
Micron is besides extending its activity pinch nan sampling of 36GB 12-High HBM3E, which is group to present greater than 1.2 TB/s capacity and superior power ratio compared to competitory solutions, successful March 2024. Micron is simply a sponsor astatine NVIDIA GTC, a world AI convention starting March 18, wherever nan institution will stock much astir its industry-leading AI representation portfolio and roadmaps.
About Micron Technology, Inc.
We are an manufacture leader successful innovative representation and retention solutions transforming really nan world uses accusation to enrich life for all. With a relentless attraction connected our customers, exertion leadership, and manufacturing and operational excellence, Micron delivers a rich | portfolio of high-performance DRAM, NAND and NOR representation and retention products done our Micron® and Crucial® brands. Every day, nan innovations that our group create substance nan information economy, enabling advances successful artificial intelligence and 5G applications that unleash opportunities — from nan information halfway to nan intelligent separator and crossed nan customer and mobile personification experience. To study much astir Micron Technology, Inc. (Nasdaq: MU), sojourn micron.com.
© 2024 Micron Technology, Inc. All authorities reserved. Information, products, and/or specifications are taxable to alteration without notice. Micron, nan Micron logo, and each different Micron trademarks are nan spot of Micron Technology, Inc. All different trademarks are nan spot of their respective owners.
Micron Media Relations Contact
Kelly Sasso
Micron Technology, Inc.
+1 (208) 340-2410
[email protected]
Micron Investor Relations Contact
Satya Kumar
Micron Technology, Inc.
+1 (408) 450-6199
[email protected]
